JPH0745974Y2 - 半導体レーザモジュール - Google Patents

半導体レーザモジュール

Info

Publication number
JPH0745974Y2
JPH0745974Y2 JP1987181092U JP18109287U JPH0745974Y2 JP H0745974 Y2 JPH0745974 Y2 JP H0745974Y2 JP 1987181092 U JP1987181092 U JP 1987181092U JP 18109287 U JP18109287 U JP 18109287U JP H0745974 Y2 JPH0745974 Y2 JP H0745974Y2
Authority
JP
Japan
Prior art keywords
semiconductor laser
package
metal block
electronic cooling
laser module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987181092U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0186260U (en]
Inventor
浩 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1987181092U priority Critical patent/JPH0745974Y2/ja
Publication of JPH0186260U publication Critical patent/JPH0186260U/ja
Application granted granted Critical
Publication of JPH0745974Y2 publication Critical patent/JPH0745974Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1987181092U 1987-11-30 1987-11-30 半導体レーザモジュール Expired - Lifetime JPH0745974Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987181092U JPH0745974Y2 (ja) 1987-11-30 1987-11-30 半導体レーザモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987181092U JPH0745974Y2 (ja) 1987-11-30 1987-11-30 半導体レーザモジュール

Publications (2)

Publication Number Publication Date
JPH0186260U JPH0186260U (en]) 1989-06-07
JPH0745974Y2 true JPH0745974Y2 (ja) 1995-10-18

Family

ID=31472590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987181092U Expired - Lifetime JPH0745974Y2 (ja) 1987-11-30 1987-11-30 半導体レーザモジュール

Country Status (1)

Country Link
JP (1) JPH0745974Y2 (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280654A (ja) * 2001-03-19 2002-09-27 Eco Twenty One:Kk 光通信用モジュール
JP2005303242A (ja) * 2004-03-19 2005-10-27 Hitachi Cable Ltd 冷却機能付き電気−光変換モジュール
JP2011129592A (ja) 2009-12-15 2011-06-30 Sumitomo Electric Ind Ltd 光半導体装置
WO2019155505A1 (ja) 2018-02-06 2019-08-15 三菱電機株式会社 熱電クーラー内蔵型ステム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193080A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd 発光半導体装置
JPS62109385A (ja) * 1985-11-07 1987-05-20 Nec Corp 半導体レ−ザ装置

Also Published As

Publication number Publication date
JPH0186260U (en]) 1989-06-07

Similar Documents

Publication Publication Date Title
JP3076246B2 (ja) ペルチェクーラ内蔵半導体レーザモジュール
US5706302A (en) Temperature control type semiconductor laser device
JP2003262766A (ja) 光結合装置
JP2002076501A (ja) 光半導体モジュールの製造方法
JPH0745974Y2 (ja) 半導体レーザモジュール
JP2000277843A (ja) 半導体レーザモジュールとその製造方法
US6116792A (en) Semiconductor laser module
JPH071811Y2 (ja) 半導体レ−ザモジユ−ル
JP2012163902A (ja) 光モジュール
JP2002314154A (ja) 熱電装置
JP3246519B2 (ja) 光半導体モジュール
JP2868353B2 (ja) 光半導体モジュールの製造方法
JPH08213688A (ja) 光モジュールの製造方法および光モジュール
JPH07209559A (ja) 光モジュールとその組立て方法
JP6496028B2 (ja) 半導体素子収納用パッケージおよび半導体装置
JP2003344722A (ja) 光通信用パッケージ及びその製造方法
JP2913890B2 (ja) 半導体レーザモジュール
JP2006269995A (ja) 熱電変換モジュール及び電子デバイス
JP2586123B2 (ja) 半導体レーザモジュール
JPH05267794A (ja) 半導体レーザモジュールのチップキャリア固定構造
JP3646692B2 (ja) 光半導体素子モジュール
JP3298532B2 (ja) 半導体レーザモジュール
JPH1022581A (ja) 温度制御型半導体レーザ装置
JP2000131568A (ja) 光半導体装置
JPH06289258A (ja) 半導体レーザ装置